Anisotropic Conductive Technology Overview. ACF technology is used in chip-on-glass (COG), flex-on-glass (FOG), flex on board (FOB), flex on flex (FOF), chip on flex (COF), chip on board (COB), and similar applications for higher signal densities and smaller overall packages. ACPs are typically used only in chip-on-flex (COF) applications with low densities and cost requirements, such as for RFID antennas, or in FOF and FOB assemblies in handheld electronics.
In all cases the anisotropic material is first deposited on the base substrate. This may be done using a lamination process for ACF, or either a dispense or printing process for ACP. The device or secondary substrate is then placed in position over the base substrate and the two sides are pressed together to mount the secondary substrate or device to the base substrate. In many cases this mounting process is done with no heat or a minimal amount of heat that is just sufficient to cause the anisotropic material to become slightly tacky. In some cases this mounting step is skipped and the two sides go directly to the bonding portion of the process. In high volume manufacturing, however, this would lead to inefficiencies in the manufacturing process, so direct bonding is usually done only in the lab or in small scale manufacturing.
Bonding is the third and final process required to complete an ACF assembly. In the first two processes the temperatures can range from ambient to 100°C, with the heat applied for 1 second or less. For bonding, the amount of thermal energy required is higher due to the need to first flow the adhesive and allow the two sides to come together into electrical contact, and then to cure the adhesive and create a lasting reliable bond. The temperatures, times, and pressure required for these processes can vary as shown in the following table.
Souce : Wikipedia
In all cases the anisotropic material is first deposited on the base substrate. This may be done using a lamination process for ACF, or either a dispense or printing process for ACP. The device or secondary substrate is then placed in position over the base substrate and the two sides are pressed together to mount the secondary substrate or device to the base substrate. In many cases this mounting process is done with no heat or a minimal amount of heat that is just sufficient to cause the anisotropic material to become slightly tacky. In some cases this mounting step is skipped and the two sides go directly to the bonding portion of the process. In high volume manufacturing, however, this would lead to inefficiencies in the manufacturing process, so direct bonding is usually done only in the lab or in small scale manufacturing.
Bonding is the third and final process required to complete an ACF assembly. In the first two processes the temperatures can range from ambient to 100°C, with the heat applied for 1 second or less. For bonding, the amount of thermal energy required is higher due to the need to first flow the adhesive and allow the two sides to come together into electrical contact, and then to cure the adhesive and create a lasting reliable bond. The temperatures, times, and pressure required for these processes can vary as shown in the following table.
Souce : Wikipedia
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