Anisotropic Conductive Current Market. ACF continues to be the most popular form factor for ACAs, largely due to the ability to precisely control the volume of material, density of the particles in any sample, and the distribution of those particles within the sample. This is particularly true in the traditional ACF stronghold of display interconnects, but ACF has also seen strong growth out of the display industry and into areas long dominated by surface-mount technologies. The ability to make interconnections in a very small XYZ space has been the key driver in this expansion, helped by the ability under certain conditions to greatly lower cost either by the reduction of component counts or total material used.
ACPs are widely used in lower-end applications, primarily in the assembly of chips on to RFID antenna substrates. They are also used in some board or flex assembly applications, but at a much lower level than ACFs. While ACPs are generally lower cost than ACFs, they cannot provide the same level of control in adhesive quantity and particle dispersion as ACF. For this reason it is very difficult to use them for high-density applications.
Cource : Wikipwedia
ACPs are widely used in lower-end applications, primarily in the assembly of chips on to RFID antenna substrates. They are also used in some board or flex assembly applications, but at a much lower level than ACFs. While ACPs are generally lower cost than ACFs, they cannot provide the same level of control in adhesive quantity and particle dispersion as ACF. For this reason it is very difficult to use them for high-density applications.
Cource : Wikipwedia
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