Anisotropic conductive adhesive for chip attachment or flip chip assembly

ACP series is a fast-curing anisotropic conductive adhesive for chip attachment or flip chip assembly (e. G. With Ni, AG, Ni/Au or Au-bumps). With prolonged storage shelf life, it is especially suitable for smart card, smart label and RFID applications. In addition to its low water absorption and high reliability at 85° C / 85% RH, it has very good adhesion to a variety of substrates including polyester, polyimide, FR4, copper, aluminum and silver etc.

Model ACP-100, ACP-200, ACP-300, Test Method
Additive size 5-10 um, 5-10 um, 5-10 um
Viscosity 25° C@10 rpm: 20-26 Pa*s, 2-5 Pa*s, 20-26 Pa*s, ASTMD1084-97
Warranty: > 6 months, > 2 years, > 1 year

Curing condition:
Min. Curing Temp.: > 120 ° C, > 120 ° C, > 120 ° C, DSC, 10K/min
Suitable pressure: 5-30s@150-210° C, 5-30s@150-210° C, 5-10 s @140-150° C
Shear strength >12 (N/cm), > 12 (N/cm), > 800 (N/cm), ASTM D412
Contact Resistance: <100 mohm, <100 mohm, <10 mohm, ASTM D257
Insulation Resistance > 10*10e ohm, > 10*10e ohm, > 10*10e ohm, ASTM D257
Suitable line/space: 50/50 um, 50/50 um, 50/50 um
Package: 5~500g
ACP100-300 should be stored at -40° C, ACP400 could be stored at room temp...
     
Trademark:      Nanowell
Model NO.:      ACP
Origin:      China
Company:     Jiangsu Nanowell Advanced Materials Co., Ltd.

http://nanowell.en.made-in-china.com